[IEEE 2015 International Conference on Electronic Packaging...

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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - A testable design for electrical interconnect tests of 3D ICs

Odoriba, Akihiro, Umezu, Shoichi, Hashizume, Masaki, Yotsuyanagi, Hiroyuki, Ali, Fara Ashikin Binti, Lu, Shyue-Kung
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Year:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111105
File:
PDF, 530 KB
english, 2015
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