Rollable Silicon IC Wafers Achieved by Backside...

IEEE Electron Device Letters 2015 / 8 Vol. 36; Iss. 8

Rollable Silicon IC Wafers Achieved by Backside Nanotexturing

Kashyap, Kunal, Zheng, Long-Chia, Lai, Dong-Yan, Hou, Max T., Yeh, J. Andrew
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Volume:
36
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/LED.2015.2439701
Date:
August, 2015
File:
PDF, 1.42 MB
english, 2015
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