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Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge
Zhang, Yang, Zhang, Yue, Bakir, Muhannad S.Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2014.2364742
Date:
December, 2014
File:
PDF, 2.68 MB
english, 2014