Silicon-on-Insulator Wafer Bonding-Wafer Thinning...

Japanese Journal of Applied Physics 1989 / 8 Vol. 28; Iss. Part 1, No

Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological Evaluations

Haisma, J., Spierings, G. A. C. M., Biermann, U. K. P., Pals, J. A.
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Volume:
28
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/JJAP.28.1426
Date:
August, 1989
File:
PDF, 5.34 MB
1989
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