[ACM Press the 50th Annual Design Automation Conference - Austin, Texas (2013.05.29-2013.06.07)] Proceedings of the 50th Annual Design Automation Conference on - DAC '13 - On effective and efficient in-field TSV repair for stacked 3D ICs
Jiang, Li, Ye, Fangming, Xu, Qiang, Chakrabarty, Krishnendu, Eklow, BillYear:
2013
Language:
english
DOI:
10.1145/2463209.2488824
File:
PDF, 425 KB
english, 2013