(Invited) Wafer-Level Integration of Embedded Cooling...

ECS Transactions 2014 / 08 Vol. 64; Iss. 5

(Invited) Wafer-Level Integration of Embedded Cooling Approaches

Paredes, S., Madhour, Y., Schlottig, G., Ong, C. L., Brunschwiler, T.
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Volume:
64
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/06405.0253ecst
Date:
August, 2014
File:
PDF, 595 KB
english, 2014
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