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Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model
Chang, K-C, Chiang, K-NVolume:
41
Language:
english
Journal:
The Journal of Strain Analysis for Engineering Design
DOI:
10.1243/030932405X16142
Date:
January, 2006
File:
PDF, 474 KB
english, 2006