Dynamic – Thermal Analyses of a Structurally Reconfigured...

Applied Mechanics and Materials 2014 / 7 Vol. 592-594

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

Veeramuthuvel, P., Jayaraman, S., Shankar, Krishnapillai, Annadurai, M., Sharma, A.K.
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Volume:
592-594
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/amm.592-594.2117
Date:
July, 2014
File:
PDF, 457 KB
english, 2014
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