Cement-Bonded Chip Boards Using Hemp and Energy by-Products in Civil Engineering
Melichar, Tomáš, Bydžovský, Jiří, Keprdová, ŠárkaVolume:
512-515
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.512-515.2956
Date:
May, 2012
File:
PDF, 289 KB
english, 2012