Reactive Diffusion upon Planar Dissolving Copper in Solder...

Reactive Diffusion upon Planar Dissolving Copper in Solder Melts

Drápala, Jaromír, Jopek, Pavel, Petlák, Daniel, Harcuba, Petr, Kubíček, Petr
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Volume:
309-310
Language:
english
Journal:
Defect and Diffusion Forum
DOI:
10.4028/www.scientific.net/ddf.309-310.127
Date:
March, 2011
File:
PDF, 3.78 MB
english, 2011
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