Microstructural Degradation Accompanying Tensile Creep...

Key Engineering Materials 2000 Vol. 175-176

Microstructural Degradation Accompanying Tensile Creep Deformation in Quasi-Ductile Silicon Nitride

Lofaj, František, Okada, Atsushi, Ikeda, Yasushi, Mizuta, Y., Usami, Hatsuhiko, Kawamoto, Hiroshi
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Volume:
175-176
Year:
2000
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.175-176.321
File:
PDF, 1.46 MB
english, 2000
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