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Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Chellvarajoo, Srivalli, Abdullah, M.Z., Khor, C.Y.Volume:
82
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2015.05.065
Date:
October, 2015
File:
PDF, 2.78 MB
english, 2015