Automated detection and quantification of hidden voids in...

NDT & E International 2015 / 09 Vol. 74

Automated detection and quantification of hidden voids in triplex bonding layers using active lock-in thermography

Song, Homin, Lim, Hyung Jin, Lee, Sangmin, Sohn, Hoon, Yun, Wonjun, Song, Eunha
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Volume:
74
Language:
english
Journal:
NDT & E International
DOI:
10.1016/j.ndteint.2015.05.004
Date:
September, 2015
File:
PDF, 7.64 MB
english, 2015
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