![](/img/cover-not-exists.png)
[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - A study of chip-last embedded FCCSP
Shin-Hua Chao,, Chih-Pin Hung,, Yishao Lai,, Liu, Colin, Hsieh, Emma, Ding-Bang Luh,Year:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111005
File:
PDF, 456 KB
english, 2015