Microstructural Evaluation of Bi-Ag and Bi-Sb Lead-Free High-Temperature Solder Candidates on Copper Substrate with Multiple Reflow Number
Nahavandi, Mahdi, Azmah Hanim, Mohamed Ariff, Ismarrubie, Z.N., Baserfalak, F.Volume:
564
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/AMM.564.388
Date:
June, 2014
File:
PDF, 4.44 MB
english, 2014