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Effect of Surface Profile on the Material Removal Rate Distribution in CMP Process
Zhou, Ping, Cai, Ji Qing, Li, Zhi Wei, Kang, Ren Ke, Jin, Zhu JiVolume:
1017
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.1017.715
Date:
September, 2014
File:
PDF, 402 KB
english, 2014