Mechanical Analyses of Advanced Multi-Chip Embedded Wafer...

Advanced Materials Research 2013 / 8 Vol. 740

Mechanical Analyses of Advanced Multi-Chip Embedded Wafer Level Packages

Ho, Siow Ling, Bu, Lin, Sorono, Dexter Velez, Chong, Ser Choong, Chai, Tai Chong, Zhang, Xiao Wu
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Volume:
740
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.740.289
Date:
August, 2013
File:
PDF, 838 KB
english, 2013
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