Improved Cleaning Process for Etch Residue Removal in an...

Solid State Phenomena 2012 / 4 Vol. 187

Improved Cleaning Process for Etch Residue Removal in an Advanced Copper/Low-k Device without the Use of DMAC (Dimethylacetamide)

Jung, Chung Kyung, Joo, Sung Wook, Ryu, Sang Wook, Naghshineeh, S., Lee, Yang, Han, Jae Won
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Volume:
187
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.187.245
Date:
April, 2012
File:
PDF, 1.32 MB
english, 2012
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