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[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - New anisotropic conductive adhesives for low cost and reliable flip chip on organic substrates applications
Kyung-Wook Paik,, Myung-Jin Yim,Year:
2000
Language:
english
DOI:
10.1109/EMAP.2000.904168
File:
PDF, 901 KB
english, 2000