Study of Near-Surface Stresses in Silicon Around...

IEEE Transactions on Device and Materials Reliability 2015 / 6 Vol. 15; Iss. 2

Study of Near-Surface Stresses in Silicon Around Through-Silicon Vias at Elevated Temperatures by Raman Spectroscopy and Simulations

Zhu, Ye, Zhang, Jiye, Li, Hong Yu, Tan, Chuan Seng, Xia, Guangrui
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Volume:
15
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2015.2401035
Date:
June, 2015
File:
PDF, 1.40 MB
english, 2015
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