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Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders
Hanim, M.A. Azmah, Ourdjini, A., Aisha, I. Siti Rabiatul, Azlina, O. SalizaVolume:
650
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.650.194
Date:
January, 2013
File:
PDF, 3.06 MB
english, 2013