Effect of Microstructure of Mo-Cu Alloy on the Thermal...

Advanced Materials Research 2013 / 12 Vol. 873

Effect of Microstructure of Mo-Cu Alloy on the Thermal Expansion Coefficient

Li, Zeng Feng, Liu, Hai Yan, Li, Ai Jun, Zhang, Han Liang, Huang, Yuan Ping, Shi, Ying
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Volume:
873
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/amr.873.67
Date:
December, 2013
File:
PDF, 709 KB
english, 2013
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