Research on Effects of Slurry Additives in Cu CMP for ULSI Manufacturing
Li, X.J., Guo, Dong Ming, Ren, R.K., Jin, Zhu JiVolume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.304-305.350
File:
PDF, 474 KB
english, 2006