Research on Effects of Slurry Additives in Cu CMP for ULSI...

Research on Effects of Slurry Additives in Cu CMP for ULSI Manufacturing

Li, X.J., Guo, Dong Ming, Ren, R.K., Jin, Zhu Ji
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Volume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.304-305.350
File:
PDF, 474 KB
english, 2006
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