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Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball
Yorita, Chiko, Kobayashi, Tatsuya, Shohji, IkuoVolume:
462-463
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/kem.462-463.849
Date:
January, 2011
File:
PDF, 780 KB
english, 2011