The Reliability of Solder Joints in Fine Pitch 3-D Stack Package by Taguchi Method
Chen, Ching I, Liu, Yu Zhen, Chen, Jian WeiVolume:
229-231
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/AMM.229-231.434
Date:
November, 2012
File:
PDF, 462 KB
english, 2012