Analysis and Modeling of Wafer Thermal Transfer in a PECVD...

Applied Mechanics and Materials 2013 / 8 Vol. 376

Analysis and Modeling of Wafer Thermal Transfer in a PECVD Reactor

Xia, Huan Xiong, Xiang, Dong, Mou, Peng, Zhang, Han
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Volume:
376
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/AMM.376.3
Date:
August, 2013
File:
PDF, 365 KB
english, 2013
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