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The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder
Mohd Salleh, M.A.A., Nik Nurhidayatul Suhada, A.R., Somidin, Flora, Ahmad, Khairel Rafezi, Lee, C.S., Hussin, KamarudinVolume:
622-623
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.622-623.195
Date:
December, 2012
File:
PDF, 367 KB
english, 2012