The Effects of Electromigration to the Solder Joint...

The Effects of Electromigration to the Solder Joint Formation: A Comparison Between 99.3Sn-0.7Cu and 96.5Sn-3.0Ag-0.5Cu Lead Free Solder

Mohd Salleh, M.A.A., Nik Nurhidayatul Suhada, A.R., Somidin, Flora, Ahmad, Khairel Rafezi, Lee, C.S., Hussin, Kamarudin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
622-623
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.622-623.195
Date:
December, 2012
File:
PDF, 367 KB
english, 2012
Conversion to is in progress
Conversion to is failed