Thermal Management of Electronic Components by Using...

Thermal Management of Electronic Components by Using Computational Fluid Dynamic (CFD) Software, FLUENTTM in Several Material Applications (Epoxy, Composite Material & Nanosilver)

Mazlan, M., Rahim, A., Mustafa Al Bakri, Abdullah Mohd, Razak, W., Zubair, A.F., Najib, Y.M., Bakir Azman, A.
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Volume:
795
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.795.141
Date:
September, 2013
File:
PDF, 310 KB
english, 2013
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