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Fabrication of Ultrafine Grained Copper Alloy by 3-Layers Accumulative Roll-Bonding Process
Lim, Cha Yong, Kim, Hyoung Wook, Lee, Seong HeeVolume:
443
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.443.158
Date:
June, 2010
File:
PDF, 1.73 MB
english, 2010