Chemical Mechanical Polish of Potential New Barrier...

Key Engineering Materials 2012 / 1 Vol. 499

Chemical Mechanical Polish of Potential New Barrier Material Ruthenium (Ru) in ULSI Copper Interconnects

Chu, Xiang Feng, Li, X.J., Dong, Y.P., Qiao, H.B., Bai, L.S.
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Volume:
499
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.499.33
Date:
January, 2012
File:
PDF, 286 KB
english, 2012
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