Analysis of Broken Wires during Gold Wire Bonding Process

Key Engineering Materials 2012 / 2 Vol. 503

Analysis of Broken Wires during Gold Wire Bonding Process

Pan, Ming Qiang, Chen, Tao, Chen, Li Guo, Sun, Li Ning
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Volume:
503
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.503.298
Date:
February, 2012
File:
PDF, 439 KB
english, 2012
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