Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints
Chen, Wen-Lin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-GongVolume:
613
Language:
english
Journal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2014.06.102
Date:
September, 2014
File:
PDF, 9.58 MB
english, 2014