Analysis on the Drop of PCB Packaged by Cushion Material...

Applied Mechanics and Materials 2013 / 2 Vol. 288

Analysis on the Drop of PCB Packaged by Cushion Material Based on Finite Element Method

Zhang, Gai Mei, Guo, Heng Yi, Lou, Yue, Tao, Qi Lu, Yuan, Wei, Lu, Jian Dong
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Volume:
288
Language:
english
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/amm.288.303
Date:
February, 2013
File:
PDF, 489 KB
english, 2013
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