Inductively coupled plasma etching of tapered via in...

Microelectronic Engineering 2015 / 06 Vol. 141

Inductively coupled plasma etching of tapered via in silicon for MEMS integration

Ren, Zhong, McNie, Mark E.
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Volume:
141
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2015.03.071
Date:
June, 2015
File:
PDF, 2.18 MB
english, 2015
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