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Multi-objective optimization for silicon wafer slicing using wire-EDM process
Dongre, Ganesh, Zaware, Sagar, Dabade, Uday, Joshi, Suhas S.Volume:
39
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2015.06.050
Date:
November, 2015
File:
PDF, 8.89 MB
english, 2015