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Thermal Laser Separation – A Novel Dicing Technology Fulfilling the Demands of Volume Manufacturing of 4H-SiC Devices
Lewke, Dirk, Dohnke, Karl Otto, Zühlke, Hans Ulrich, Cerezuela Barret, Mercedes, Schellenberger, Martin, Bauer, Anton, Ryssel, HeinerVolume:
821-823
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.821-823.528
Date:
June, 2015
File:
PDF, 2.65 MB
english, 2015