Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating
Park, Janghoon, Lee, Jongsu, Park, Sungsik, Shin, Kee-Hyun, Lee, DongjinVolume:
82
Language:
english
Journal:
The International Journal of Advanced Manufacturing Technology
DOI:
10.1007/s00170-015-7507-2
Date:
February, 2016
File:
PDF, 2.75 MB
english, 2016