Reflow flip-chip bonding technology for infrared detectors
Huang, Yue, Lin, Chun, Ye, Zhen-Hua, Ding, Rui-JunVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/8/085009
Date:
August, 2015
File:
PDF, 1.13 MB
english, 2015