Coupling effects of mechanical vibrations and thermal...

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Microelectronics Reliability 2015 / 7

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints

Ding, Ying, Tian, Ruyu, Wang, Xiuli, Hang, Chunjin, Yu, Fang, Zhou, Ling, Meng, Xiangang, Tian, Yanhong
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.06.118
Date:
July, 2015
File:
PDF, 2.63 MB
english, 2015
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