[ACM Press the 2006 international symposium - Tegernsee, Bavaria, Germany (2006.10.04-2006.10.06)] Proceedings of the 2006 international symposium on Low power electronics and design - ISLPED '06 - Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
Yu, Hao, Shi, Yiyu, He, Lei, Karnik, TanayYear:
2006
Language:
english
DOI:
10.1145/1165573.1165611
File:
PDF, 912 KB
english, 2006