Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
Yu, Hao, Ho, Joanna, He, LeiVolume:
14
Language:
english
Journal:
ACM Transactions on Design Automation of Electronic Systems
DOI:
10.1145/1529255.1529263
Date:
May, 2009
File:
PDF, 1.06 MB
english, 2009