Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy
WU, Dan, YANG, Lei, SHI, Chang-dong, WU, Yu-cheng, TANG, Wen-mingVolume:
25
Language:
english
Journal:
Transactions of Nonferrous Metals Society of China
DOI:
10.1016/S1003-6326(15)63808-0
Date:
June, 2015
File:
PDF, 2.95 MB
english, 2015