Preferential void formation at crystallographically ordered...

Acta Materialia 2015 / 09 Vol. 96

Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films

LaGrange, Thomas, Arakawa, Kazuto, Yasuda, Hidehiro, Kumar, Mukul
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Volume:
96
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2015.06.015
Date:
September, 2015
File:
PDF, 2.38 MB
english, 2015
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