Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate
Kanlayasiri, Kannachai, Ariga, TadashiVolume:
86
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2015.07.108
Date:
December, 2015
File:
PDF, 3.23 MB
english, 2015