Microstructural evaluation and failure analysis of Ag wire...

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Microelectronics Reliability 2015 / 7

Microstructural evaluation and failure analysis of Ag wire bonded to Al pads

Choi, Mi-Ri, Kim, Hyung-Giun, Lee, Taeg-Woo, Jeon, Young-Jun, Ahn, Yong-Keun, Koo, Kyo-Wang, Jang, You-Cheol, Park, So-Yeon, Yee, Jae-Hak, Cho, Nam-Kwon, Kang, Il-Tae, Kim, Sangshik, Han, Seung-Zeon,
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.07.038
Date:
July, 2015
File:
PDF, 6.73 MB
english, 2015
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