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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate
Lim, Ju Dy, Lee, Pui Mun, Rhee, Daniel Min Woo, Leong, Kam Chew, Chen, ZhongVolume:
355
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2015.07.141
Date:
November, 2015
File:
PDF, 2.05 MB
english, 2015