A novel flat polymer heat pipe with thermal via for cooling...

Energy Conversion and Management 2015 / 08 Vol. 100

A novel flat polymer heat pipe with thermal via for cooling electronic devices

Yang, Kai-Shing, Yang, Tsung-Yi, Tu, Cheng-Wei, Yeh, Chih-Ting, Lee, Ming-Tsang
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Volume:
100
Language:
english
Journal:
Energy Conversion and Management
DOI:
10.1016/j.enconman.2015.04.063
Date:
August, 2015
File:
PDF, 1.43 MB
english, 2015
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