High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications
de Veen, P.J., Bos, C., Hoogstede, D.R., Revenberg, C.Th.A., Liljeholm, J., Ebefors, T.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.06.065
Date:
July, 2015
File:
PDF, 1.78 MB
english, 2015