Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application
Ji, Hongjun, Qiao, Yunfei, Li, MingyuLanguage:
english
Journal:
Scripta Materialia
DOI:
10.1016/j.scriptamat.2015.07.036
Date:
August, 2015
File:
PDF, 1.23 MB
english, 2015