Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material
Lee, Chang-Chun, Lin, Yu-Min, Guo, Yu-Huan, Zhan, Chau-Jie, Chang, Tao-Chih, Dzeng, Yu-HuaVolume:
118
Language:
english
Journal:
Vacuum
DOI:
10.1016/j.vacuum.2015.01.001
Date:
August, 2015
File:
PDF, 3.39 MB
english, 2015